Chip-embedded micrometer scale two-phase cooling technology can be essential to fully optimize the benefits of improved integration density of three-dimensional (3D) stacking in high performance integrated circuits (ICs) for future computing systems; but is faced with significant developmental challenges including high fidelity modeling. In the present work, an Eulerian multiphase model has been developed for simulating two-phase evaporative cooling through chip embedded microscale cavities populated with pin-fins. First the model is used to predict the flow and heat transfer characteristics for coolant R1234ze flowing through a two-port ∼10 mm long micro-cavity populated with 80 μm diameter pin-fins arranged in an in-line manner. The flow is sub-cooled in the initial section of the cavity and saturated in the remaining. The results were compared to experimental data available from fundamental experiments, focusing on the model capability to predict the correct flow pattern, temperature profile and pressure drop.