Publication
ISSCC 1972
Conference paper

Electrical analysis of interconnections in a solid-state circuit environment

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Abstract

INCREASING INTEGRATED circuit densities challenge the package designer, especially in the realm of high-speed digital and microwave circuits. Multiconductor structures serve as connections between small active devices and the circuit chips. Hence, analysis of the transmission properties of these conductors is vital for the design of appropriate interconnections.

Date

16 Feb 1972

Publication

ISSCC 1972

Authors

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