About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
ISSCC 1972
Conference paper
Electrical analysis of interconnections in a solid-state circuit environment
Abstract
INCREASING INTEGRATED circuit densities challenge the package designer, especially in the realm of high-speed digital and microwave circuits. Multiconductor structures serve as connections between small active devices and the circuit chips. Hence, analysis of the transmission properties of these conductors is vital for the design of appropriate interconnections.