PaperSmall Signal Capacitance in Ferroelectric HZO: Mechanisms and Physical InsightsRevanth Kodoru, Atanu Saha, et al.arXiv
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperGlassy behaviour in high-Tc superconductorsI. Morgenstern, K.A. Müller, et al.Physica B: Physics of Condensed Matter