PublicationVide: Science, Technique et ApplicationsPaperDry etch challenges of 0.25 μm dual damascene structuresVide: Science, Technique et ApplicationsAbstractNo abstract available.Home↳ PublicationsDate01 Dec 1997PublicationVide: Science, Technique et ApplicationsAuthorsR.F. SchnabelD. DobuzinskiF. WangD.C. PerngJ.P. GambinoH. PalmIBM-affiliated at time of publicationTopicsMaterials DiscoveryShare
