About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Conference paper
Developing a "physical" model for vias
Abstract
Vias in printed circuit boards (PCBs) and packages are among the components of most concern with respect to signal and power integrity in high-speed communication systems. A good amount of research has been conducted to analyze their behavior. However, when it comes to "physical" or "physics-based" understanding and modeling, vias prove to be quite elusive due to their complex environment. In our opinion the lack of physical via models leads to increased design times and over-engineering, both of which negatively impact system cost. In this paper we will review existing models and summarize our results based on measurements and simulations.