Design of a silicon-on-silicon multi-chip module for a high-performance Ps/2 workstation

Abstract

A silicon-on-silicon multichip module design, which addresses several issues unique to low-end machines, is described. Among these are mixing bipolar and CMOS chips, practicing flip-chip and wirebonding on the same substrate, and customizing the power plane to supply multiple voltage levels. Following a description of the module design, the issue of performance in microprocessor-based machines as a driver for multichip module technology is discussed.