High-density, array, optical interconnects for multi-chip modules

Abstract

A compact, planar-processed package using flip-chip, self-aligned optoelectronic components is described. The optoelectronic module contains both a four-channel AlGaAs laser transmitter and a four-channel GaAs MESFET integrated detector/preamp receiver on a single substrate. The optical waveguides act as an optical bench which mechanically aligns the optoelectronic components, waveguides, and off-module fiber ribbon connector interface. Preliminary measurements have been carried out by operating the packaged receiver arrays with a commercially available reference laser source at a data rate of 1 Gb/s. Results are reported.