Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
Workshop paperIdentifying Extreme Regimes in Climate-Scale Digital Twins: a RoadmapEloisa BentivegnaBig Data 2022
PaperUranium alkoxide chemistryV. Synthesis, characterization and interconversion of uranium(IV) tert-butoxide complexesWilliam G. Van der Sluys, Alfred P. Sattelberger, et al.Polyhedron
