Franco Stellari, Peilin Song, et al.
IRPS 2009
Two commonly used Pb-free solders, SnAg and SnCu, are studied for electromigration (EM) reliability. Two major EM failure mechanisms are identified in Sn-based Pb-free solders, which is mainly due to the differences in microstructures and Sn-grain orientation. In general, the EM damage in SnCu solder is driven by the fast interstitial diffusion of Ni and Cu away from solder/UBM interface and leads to early fails; while the damage in SnAg solders is mostly dominated by Sn-self diffusion resulting in longer lifetime. The effective activation energy is 0.95 eV for SnAg solder and 0.54 eV for SnCu solder. The current density power law exponent is 2 for SnAg and 1.2 for SnCu, respectively. Blech effect is observed in the solders with Sn-self diffusion dominated failures. The roles of Ag and Cu on EM performance will be discussed. ©2009 IEEE.
Franco Stellari, Peilin Song, et al.
IRPS 2009
Minhua Lu
Journal of the Society for Information Display
Minhua Lu, Larry Mok, et al.
ASME Journal of Electronic Packaging
Minhua Lu, Paul Lauro, et al.
InterPACK 2011