PaperLowering the formation temperature of the C54-TiSi2 phase using a metallic interfacial layerC. Cabral Jr., L. Clevenger, et al.Journal of Materials Research
PaperElectromigration of Ni in Al thin-film conductorsF.M. D'Heurle, A. Gangulee, et al.Journal of Applied Physics
PaperResistivity of the solid solutions (Co-Ni)Si2F.M. D'Heurle, J. Tersoff, et al.Journal of Applied Physics
PaperSilicides of ruthenium and osmium: Thin film reactions, diffusion, nucleation, and stabilityC.S. Petersson, J.E.E. Baglin, et al.Journal of Applied Physics