Conference paper
Role of Cu in TDDB of low-k dielectrics
J.R. Lloyd, S. Ponoth, et al.
IRPS 2007
The (buried) interface between a polycrystalline Al thin-film feature and its substrate (single crystal Si) was characterized with x-ray microdiffraction. Using a focused x-ray beam (effective spot size on the specimen ∼2×12 μm) with the Si 004 reflection, topographic images of the Si around and under the metallization feature were constructed. Comparison with shear-lag model calculations indicate that the interface is not fully coupled despite the absence of surface cracks. © 1998 American Institute of Physics.
J.R. Lloyd, S. Ponoth, et al.
IRPS 2007
A. Grill, S. Gates, et al.
IITC 2008
T. Nogami, S. Lane, et al.
VMIC 2005
X.-H. Liu, T.M. Shaw, et al.
IITC 2007