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IEEE Transactions on Advanced Packaging
New concepts are introduced relating aspects of circuit theory to the multicapacitances which can be obtained from a computer program for multiconductor geometries. These concepts are applied to the wiring of an integrated circuit chip. Capacitances are found for crossovers, vias, and right angle bends for a realistic geometry. Copyright © 1975 by The Institute of Electrical and Electronics Engineers, Inc.
Stefano Grivet-Talocia, Hao-Ming Huang, et al.
IEEE Transactions on Advanced Packaging
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EMC 1999
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