About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
IEEE JSSC
Paper
Capacitance Models for Integrated Circuit Metallization Wires
Abstract
New concepts are introduced relating aspects of circuit theory to the multicapacitances which can be obtained from a computer program for multiconductor geometries. These concepts are applied to the wiring of an integrated circuit chip. Capacitances are found for crossovers, vias, and right angle bends for a realistic geometry. Copyright © 1975 by The Institute of Electrical and Electronics Engineers, Inc.