Capacitance Models for Integrated Circuit Metallization Wires

Abstract

New concepts are introduced relating aspects of circuit theory to the multicapacitances which can be obtained from a computer program for multiconductor geometries. These concepts are applied to the wiring of an integrated circuit chip. Capacitances are found for crossovers, vias, and right angle bends for a realistic geometry. Copyright © 1975 by The Institute of Electrical and Electronics Engineers, Inc.