About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
IEEE International Symposium on Electronics and the Environment 1997
Conference paper
Biobased epoxy resins for computer components and printed wiring boards
Abstract
Lignin, a by-product of paper manufacturing, has been used to develop a new series of resins for various computer components, particularly printed wiring boards (PWB). PWB's are commonly fabricated from epoxy/fiberglass laminates onto which electrical components are mounted. Replacement of the current petroleum derived phenolic epoxy resins with bio-based materials would reduce the environmental concerns with the fabrication, assembly, and disposal of PWB's. Resins used in PWB's must have a high glass transition temperature, low moisture absorption, high thermal stability, flame retardancy and good dielectric properties. Lignin is the only common phenolic-based biopolymer, thus it is naturally hydrophobic and has good thermal stability. Resin formulations which are lignin/epoxy copolymers (containing at least 50% lignin) exhibit acceptable physical and electrical properties for a wide range of applications, including PWB's. Laminates formed from lignin based resins can be processed in a similar fashion to current laminates, minimizing the financial considerations of converting to this resin system.