Conference paper
Copper contact metallization for 22 nm and beyond
Soon-Cheon Seo, Chih-Chao Yang, et al.
IITC 2009
Variability induced by bias temperature instability is an increasing concern in aggressively scaled CMOS technologies. To assess the stochastic nature of the instability, we demonstrate that the recently introduced voltage ramp stress methodology properly captures the variance component and thus can be used to study stochastic effects related to transistor design and gate-stack processes. © 2013 IEEE.
Soon-Cheon Seo, Chih-Chao Yang, et al.
IITC 2009
Eduard Cartier, Amlan Majumdar, et al.
ESSDERC 2017
Andreas Kerber, Eduard Cartier
IEEE Electron Device Letters
P. Jamison, John Massey, et al.
IMCS 2020