Analysis of cluster tool performance in semiconductor manufacturing

Abstract

The use of cluster tools in semiconductor manufacturing has increased rapidly over the last few years. However, the benefits derived from increased clustering have not been fully analyzed with respect to improved productivity. Detailed simulation models of cluster tools provide a means to evaluate the various performance characteristics as a function of application specific process and equipment parameters. In particular, this work examines models for an integrated vacuum etch tool and a parallel processing wet bench. The relationship between static and dynamic tool throughput is investigated in the context of a DRAM manufacturing facility. Throughput and cycle times are differentiated when tools are capable of handling multiple lots. The impact of this on equipment requirements is quantified. The models developed and implemented in this work are intended to provide the basis for a standardized, PC based, library of equipment models with user friendly interfaces for continued use by the process/equipment engineering community.