Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
PaperWill OLED displays challenge liquid crystal displays in notebook computer applications?Ronald TroutmanSynthetic Metals
PaperThe boundary contour method for three-dimensional linear elasticityA. Nagarajan, S. Mukherjee, et al.Journal of Applied Mechanics, Transactions ASME
TalkAssessing wildfires hazards around the electric gridFernando Marianno, Wang Zhou, et al.INFORMS 2021
