A TEM Study of the Effect of Accelerators on Pd-Sn Colloidal Catalysts and on the Initiation of Electroless Cu Deposition on Epoxy

Abstract

A technique was developed for the preparation of transparent, thin film epoxy samples for direct TEM investigation of the activation of epoxy and the initiation of the electroless Cu reaction. Associated EDX measurements determined the composition of the nucleated Cu particles. The steps of activation with a Pd-Sn colloidal catalyst, acceleration with NaOH, HC1, or EDTA, and initiation of electroless Cu plating were studied individually. All of the accelerators were effective in removing tin from the surface and increasing the initial rate of Cu deposition. The Cu distribution on the epoxy was determined by the accelerator, with NaOH and EDTA giving the most uniform distributions. © 1987, The Electrochemical Society, Inc. All rights reserved.