PaperCrystal structure and cation distribution of MnCrInS4 from synchrotron powder diffraction dataG. Will, N. Masciocchi, et al.Zeitschrift fur Kristallographie - New Crystal Structures
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
Conference paperHigh-performance sub-0.08 μm CMOS with dual gate oxide and 9.7 ps inverter delayM. Hargrove, S.W. Crowder, et al.IEDM 1998
