Publication
IEEE-SPI 2004
Conference paper
A new in-situ approach to flip-chip interconnect characterization up to millimeter wave FRequencies
Abstract
In this paper we present the performance of flip-chip interconnects up to 40 GHz based on an alternative non-destructive measurement technique. The presented method unfolds the raw flip-chip interconnect, excluding any launch structures for an actually mounted silicon chip. A preliminary modeling approach for chip-package co-design will be outlined.