CMOS Integrated Nano Photonics (CINPs) hold promise for bringing semiconductor industry efficiency and dramatic cost reductions to optical interconnect applications . IBM has developed a CINP technology (TX) (CMOS9WG) in a sub-100nm CMOS platform where electronic and photonic components are monolithically integrated into the CMOS circuit analog and mixed-signal frontend. This minimizes processing steps, mask levels, component parasitics, and packaging/assembly complexity, and is designed to enabled multi-channel short reach optical interconnects up to 25 Gbaud rates . Hybrid technology solutions also exist, where electrical and optical components are on separate chips . Hybrid and monolithic platforms each offer unique advantages. However, the monolithic platform has the distinct advantage of being able to address both the hybrid and monolithic approaches.