Analog AI
Making Deep Neural Network systems more capable and energy-efficient.
Making Deep Neural Network systems more capable and energy-efficient.
We’re developing new materials for both the smallest length scale (<20nm) and largest length scale (>20mm) of semiconductor fabrication.
Developing a new chiplet integration technology using silicon bridge for advanced semiconductor packaging.
Platform technology research: innovation and solution creation for leading edge CMOS technology at 2nm node.
IBM is a founding member of ASIC, a diverse group united to advocate for U.S. semiconductor leadership.