IBM at ECTC 2026

IBM is proud to sponsor the Electronic Components and Technology Conference, ECTC 2026.

ECTC is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).

The technical program contains papers covering leading edge developments and technical innovations across the packaging spectrum. Topics include advanced packaging, modeling and simulation, Photonics, interconnections, materials and processing, applied reliability, assembly and manufacturing technology, components and RF, and emerging technologies. Both poster and presentation formats are used. Special papers presented at the ECTC will be awarded the Intel Best Student Paper Award and best and outstanding paper awards.

The Panel, Plenary, Special Sessions, and EPS Seminar provide the conference participants the opportunity to gain the insight and perspective of technical and business leaders.

Visit the technical program linked below to see IBM contributions.

Bring your networking to the next level at ECTC! With technical sessions, panels, interactive presentations, a high energy exhibition floor, luncheons, evening receptions, and numerous coffee breaks you can connect with peers and leaders from semiconductor and electronics manufacturing, foundries and OSATs, substrate and materials suppliers, equipment makers, research institutions, design houses, and universities.

Build relationships, meet customers and collaborators, discover suppliers and new partners – all within four days that bring together the entire microelectronics packaging community.