3D system design: A case for building customized modular systems in 3D
- Philip Emma
- Eren Kursun
- 2010
- IITC 2010
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4 results at IITC 2010
A comparative study of ULK conduction mechanisms and TDDB characteristics for Cu interconnects with and without CoWP metal cap at 32nm technology
- F. Chen
- E. Huang
- et al.
- 2010
- IITC 2010
CVD Co and its application to Cu damascene interconnections
- Takeshi Nogami
- J. Maniscalco
- et al.
- 2010
- IITC 2010
Molecular design of ultra-low-k hybrid glasses
- Mark Oliver
- Geraud Dubois
- et al.
- 2010
- IITC 2010