Direct Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2026
- ECTC 2026
Conference paper
Publications
5 results at ECTC 2026
Fluxless TCB with Atmospheric Pressure Plasma Surface Treatment Enabling Ultra-Fine Pitch Solder Micro-Bumps for 3D Integration
- Mohammed Alhendi
- Luke Darling
- et al.
- 2026
- ECTC 2026
Short paperHybrid bonding surface roughness characterization: A RHEED approach with high speed and atomic scale (sub-nm) sensitivity at wafer level
- Weichang Lin
- Nicholas Polomoff
- et al.
- 2026
- ECTC 2026
TalkExploring Cu-Cu Hybrid Bonding Failure Mechanisms under Current Stress via 3D Focused Ion Beam Tomography
- Sari Zerey
- Junghyun Cho
- et al.
- 2026
- ECTC 2026
TalkAdvanced Acoustic Emission (AE) Sensing and Analytics Scheme for In-situ Warpage Characterizations of Flip-Chip Packaging
- Yigit Turan
- Xinchen Wang
- et al.
- 2026
- ECTC 2026
Poster