Thermomechanical FEM Analysis of Sn-Bi Solder Joint During Temperature Cycling for Fine Pitch 1st Level Interconnect
- Toyohiro Aoki
- Yasuharu Yamada
- et al.
- 2025
- ICEP-IAAC 2025
Conference paper
Publications
2 results at ICEP-IAAC 2025
Effect of Interfacial Wetting on First Level Interconnect Joint Formation For Low Temperature Solders-iNEMI Project
- Shripad Gokhale
- Edvin Cetegen
- et al.
- 2025
- ICEP-IAAC 2025
Conference paper