Interaction of middle-of-line (MOL) temperature and mechanical stress on 90nm hi-speed device performance and reliability
- K.Y. Lim
- V. Chan
- et al.
- 2005
- ESSDERC 2005
Conference paper
Publications
2 results at ESSDERC 2005
3-D thermal modeling of FinFET
- R.V. Joshi
- José A. Pascual-Gutiérrez
- et al.
- 2005
- ESSDERC 2005
Conference paper