Effects of environment on modulus of low-k porous films used in back end of lineEva E. SimonyiChristos D. Dimitrakopouloset al.2007MRS Spring Meeting 2007
Application of scatterometry to BEOL measurements: Post Cu CMP measurementsDeepak KulkarniShorn Ponothet al.2007MRS Spring Meeting 2007
Improved electromigration lifetime for copper interconnects using tantalum implantJeff GambinoTimothy D. Sullivanet al.2007MRS Spring Meeting 2007