Publications

2 results at GBC 2008

Extended abstract :C4NP - solder bumps for flip chip and microbumps for 3D
- - Klaus Ruhmer
  - David Hawken
  - et al.
- 2008
- GBC 2008
C4NP technology: Present and future
- - Eric Perfecto
  - Da-Yuan Shih
  - et al.
- 2008
- GBC 2008