Application of foldy-lax multiple scattering method to via analysis in multi-layered printed circuit board
- Xiaoxiong Gu
- Mark B. Ritter
- 2008
- DesignCon 2008
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Multi-level signaling in high-density, high-speed electrical links
- Dong G. Kam
- Troy J. Beukema
- et al.
- 2008
- DesignCon 2008