Publications

Low-profile 3D silicon-on-silicon multi-chip assembly
- - Paul Andry
  - Bing Dang
  - et al.
- 2011
- ECTC 2011
Surface-tension-driven multi-chip self-alignment techniques for heterogeneous 3D integration
- - Fengda Sun
  - Yusuf Leblebici
  - et al.
- 2011
- ECTC 2011
3D Chip stacking with 50 μm pitch lead-free micro-c4 interconnections
- - Joana Maria
  - Bing Dang
  - et al.
- 2011
- ECTC 2011
Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
- - Jae-Woong Nah
  - Michael A. Gaynes
  - et al.
- 2011
- ECTC 2011
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- - Katsuyuki Sakuma
  - Kazushige Toriyama
  - et al.
- 2011
- ECTC 2011
Electromagnetic-SPICE modeling and analysis of 3D power network
- - Zheng Xu
  - Jian-Qiang Lu
  - et al.
- 2011
- ECTC 2011
High performance wafer level underfill material with high filler loading
- - Satoru Katsurayama
  - Hiroshi Suzuki
  - et al.
- 2011
- ECTC 2011
High-bandwidth density optical I/O for high-speed logic chip on waveguide-integrated organic carrier
- - Masao Tokunari
  - Yutaka Tsukada
  - et al.
- 2011
- ECTC 2011
Terabit/sec-class board-level optical interconnects through polymer waveguides using 24-channel bidirectional transceiver modules
- - Fuad E. Doany
  - Clint L. Schow
  - et al.
- 2011
- ECTC 2011
Vacuum underfill technology for advanced packaging
- - Akihiro Horibe
  - M.-C. Paquet
  - et al.
- 2011
- ECTC 2011