Flip chip assembly method employing differential heating/cooling for large dies with coreless substrates
- Katsuyuki Sakuma
- Edmund Blackshear
- et al.
- 2013
- ECTC 2013
Publications
Enhanced multilayer organic packages with embedded phased-array antennas for 60-GHz wireless communications
- Xiaoxiong Gu
- Dong Gun Kam
- et al.
- 2013
- ECTC 2013
Power delivery modeling for 3D systems with non-uniform TSV distribution
- Huanyu He
- Zheng Xu
- et al.
- 2013
- ECTC 2013
Coupling task progress for MapReduce resource-aware scheduling
- Jian Tan
- Xiaoqiao Meng
- et al.
- 2013
- INFOCOM 2013
Endhost-based shortest path routing in dynamic networks: An online learning approach
- Ting He
- Dennis Goeckel
- et al.
- 2013
- INFOCOM 2013
Optimal bounds for online page migration with generalized migration costs
- Johannes Schneider
- Stefan Schmid
- 2013
- INFOCOM 2013
Low-latency and high bandwidth TCP/IP protocol processing through an integrated HW/SW approach
- Ken Inoue
- Davide Pasetto
- et al.
- 2013
- INFOCOM 2013
Hybrid client-server and peer-to-peer caching systems with selfish peers
- Youngmi Jin
- Yung Yi
- et al.
- 2013
- INFOCOM 2013
Sustainable energy consumption monitoring in residential settings
- Akshay Uttama Nambi
- Thanasis G. Papaioannou
- et al.
- 2013
- INFOCOM 2013
Dependable virtual machine allocation
- Hiroki Yanagisawa
- Takayuki Osogami
- et al.
- 2013
- INFOCOM 2013