Benchmarking Power Delivery Network Designs at the 5-nm Technology NodeNicholas A. LanzilloAlbert M. Chuet al.2021IEEE T-ED
Fully On-Chip MAC at 14 nm Enabled by Accurate Row-Wise Programming of PCM-Based Weights and Parallel Vector-Transport in Duration-FormatPritish NarayananStefano Ambrogioet al.2021IEEE T-ED
Noise-Resilient DNN: Tolerating Noise in PCM-Based AI Accelerators via Noise-Aware TrainingSanjay KariyappaHsinyu Tsaiet al.2021IEEE T-ED
Heterogeneous integration of III-V materials by direct wafer bonding for high-performance electronics and optoelectronicsDaniele CaimiPreksha Tiwariet al.2021IEEE T-ED
Spatially Resolved Diffusion of Aluminum in 4H-SiC during Postimplantation AnnealingJohanna MutingViktor Bobalet al.2020IEEE T-ED
Impact of hot-carrier degradation on drain-induced barrier lowering in multifin SOI n-Channel FinFETs with self-heatingCharu GuptaAnshul Guptaet al.2020IEEE T-ED
Facts and Myths of Dielectric Breakdown Processes-Part II: Post-Breakdown and VariabilityErnest Y. Wu2019IEEE T-ED
Facts and Myths of Dielectric Breakdown Processes-Part I: Statistics, Experimental, and Physical Acceleration ModelsErnest Y. Wu2019IEEE T-ED
Low-Noise Schottky Junction Trigate Silicon Nanowire Field-Effect Transistor for Charge SensingXi ChenSi Chenet al.2019IEEE T-ED
Investigation of Pt-Salt-Doped-Standalone-Multiwall Carbon Nanotubes for On-Chip Interconnect ApplicationsJie LiangRongmei Chenet al.2019IEEE T-ED