The application of electrodeposition processes to advanced package fabrication
- S. Krongelb
- J. Dukovic
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
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2 results for A.T. Pfeiffer
Advantages and special considerations in fabricating bubble circuits by electroplating and sputter etching
- L. Romankiw
- S. Krongelb
- et al.
- 1974
- IEEE Transactions on Magnetics