High performance wafer level underfill material with high filler loading
- Satoru Katsurayama
- Hiroshi Suzuki
- et al.
- 2011
- ECTC 2011
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This is our catalog of publications authored by IBM researchers, in collaboration with the global research community. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.
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2 results for Hiroshi Suzuki
Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
- Jae-Woong Nah
- Michael A. Gaynes
- et al.
- 2011
- ECTC 2011