Skip to main content
Research
Focus areas
Blog
Publications
Careers
About
Back
Focus areas
Semiconductors
Artificial Intelligence
Quantum Computing
Hybrid Cloud
Back
About
Overview
Labs
People
Back
Semiconductors
Back
Artificial Intelligence
Back
Quantum Computing
Back
Hybrid Cloud
Back
Overview
Back
Labs
Back
People
Research
Focus areas
Semiconductors
Artificial Intelligence
Quantum Computing
Hybrid Cloud
Blog
Publications
Careers
About
Overview
Labs
People
Open IBM search field
Close
Publications
Home
↳
Publications
Filter by
Filter by
Open menu
Sort by
Sort by
Featured
Newest
Sort by
Featured
Open menu
Date
Start
End
Featured collections
AAAI 2025
SPIE Advanced Lithography + Patterning 2025
NeurIPS 2024
AGU 2024
IEDM 2024
MRS Fall Meeting 2024
Popular topics
AI Hardware
Foundation Models
Machine Learning
Materials Discovery
Quantum Safe
Quantum Software
Quantum Systems
Semiconductors
1 result for
W.C. Huang
Cu-based bonding technology for 3D integration applications
K.N. Chen
Zheng Xu
et al.
2012
3DIC 2012
