Direct Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2026
- ECTC 2026
Conference paper
Publications
2 results for Atom Watanabe
Direct Bridge Multi-die (DBrM) Package: A Novel Silicon Bridge Chiplet Packaging Technology Using Die-Edge Gluing Technique for Chip Reconstitution
- Akihiro Horibe
- Chinami Marushima
- et al.
- 2026
- ECTC 2026
Conference paper