Novel Advanced Low-k Dielectric for 2 nm and Beyond Cu and Post Cu Dual Damascene BEOL Interconnect TechnologiesSon NguyenHuai Huanget al.2025VLSI Technology and Circuits 2025
The Extreme Extendibility of Cu and Post-Cu Dual Damascene BEOL Interconnect TechnologyDaniel EdelsteinSon Nguyenet al.2024IEDM 2024
Backside power distribution for nanosheet technologies beyond 2nmRuilong XieWonhyuk Honget al.2024VLSI Technology and Circuits 2024
Flowable Chemical Vapor Deposition of Lightly Porous Low k SiCOH Dielectrics—Remote Plasma Deposition Processing, Film Analysis and Gap-Fill Application in Nano Device FabricationSon NguyenThomas Haighet al.2022MRS Fall Meeting 2022