Plating-free Bumping by Cu Nanopaste and Injection Molded Solder (IMS) for Fine Pitch Flip Chip Joining
- Toyohiro Aoki
- Eiji Nakamura
- et al.
- 2020
- ECTC 2020
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3 results for Nobuhiro Sekine
Morphology and Mechanical property of Cu pillar formed by sintered Cu nanoparticles for the plating-free bumping process
- Chinami Marushima
- Toyohiro Aoki
- et al.
- 2021
- ICEP 2021
Characterization of sintered Cu nanopaste for micro-bumping with Injection Molded Solder technology
- Eiji Nakamura
- Toyohiro Aoki
- et al.
- 2021
- Advancing Microelectronics