A DUAL DAMASCENE HARD METAL CAPPED CU AND AL-ALLOY FOR INTERCONNECT WIRING OF ULSI CIRCUITS
- H. Dalai
- R.V. Joshi
- et al.
- 1993
- IEDM 1993
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A Highly Reliable Low Temperature Al-Cu Line/Via Metallization for Sub-Half Micrometer CMOS
- R.V. Joshi
- H. Dalai
- et al.
- 1995
- IEEE Electron Device Letters
A novel application of polyimide-W-AI/CU for VLSI interconnect
- R.V. Joshi
- L. Hsu
- et al.
- 1991
- VMIC 1991