Interfacial sliding in Cu/Ta/polyimide high density interconnects as a result of thermal cycling
- D.V. Zhmurkin
- T.S. Gross
- et al.
- 1997
- Journal of Electronic Materials
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Thermomechanical deformation of 1 μm thick Cu-polyimide line arrays studied by scanning probe microscopy
- D.V. Zhmurkin
- T.S. Gross
- et al.
- 1996
- Journal of Electronic Materials