Silicon containing polymer in applications for 193 nm high NA lithography processes
- Scan Bums
- Dirk Pfeiffer
- et al.
- 2006
- SPIE Advanced Lithography 2006
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7 results for Scott D. Allen
Hardmask technology for sub-100 nm lithographic imaging
- Katherina Babich
- Arpan P. Mahorowala
- et al.
- 2003
- Microlithography 2003
Impact of thin resist processes on post-etch LER
- Arpan P. Mahorowala
- Dario L. Goldfarb
- et al.
- 2003
- Microlithography 2003
Highly etch selective spin-on bottom antireflective coating for use in 193 nm lithography and beyond
- Dirk Pfeiffer
- Arpan Mahorowala
- et al.
- 2003
- Microlithography 2003
Controlling line-edge roughness and reactive ion etch lag in sub-150 nm features in borophosphosilicate glass
- Parijat Bhatnagar
- Siddhartha Panda
- et al.
- 2007
- Journal of Applied Physics
Integrated non-SO 2 underlayer and improved line-edge-roughness dielectric etch process using 193 nm bilayer resist
- Parijat Bhatnagar
- Siddhartha Panda
- et al.
- 2006
- Applied Physics Letters
Effect of thin-film imaging on line edge roughness transfer to underlayers during etch processes
- Dario L. Goldfarb
- Arpan P. Mahorowala
- et al.
- 2004
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures