Publications

2 results for Jiantao Zheng

Delamination mechanisms of thermal interface materials in organic packages during reflow and moisture soaking
- - Jiantao Zheng
  - Virendra Jadhav
  - et al.
- 2009
- ECTC 2009
3D chip stacking with C4 technology
- - Bing Dang
  - Steven L. Wright
  - et al.
- 2008
- IBM J. Res. Dev