Scatterometry-informed machine learning study to determine bi-directional intercorrelation of adjacent patterning steps
- Padraig Timoney
- Stefan Schoeche
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025
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Spectral Interferometry for TSV Metrology in Chiplet Technology
- Stefan Schoeche
- Daniel Schmidt
- et al.
- 2024
- SPIE Advanced Lithography + Patterning 2024