Moisture diffusion in electronic packages. I. Transport within face coatings
- L.T. Nguyen
- C.A. Kovac
- 1987
- International SAMPE Electronics Conference 1987
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4 results for L.T. Nguyen
Wire bond behavior during molding operations of electronic packages
- L.T. Nguyen
- 2004
- Polymer Engineering & Science
Residual stresses in polymeric passivation and encapsulation materials
- I.C. Noyan
- L.T. Nguyen
- 2004
- Polymer Engineering & Science
X‐ray determination of encapsulation stresses on silicon wafers
- L.T. Nguyen
- I.C. Noyan
- 2004
- Polymer Engineering & Science