Conference paperA scalable, digital BIST circuit for measurement and compensation of static phase offsetKeith A. Jenkins, Lionel LiVTS 2009
Conference paperElectrical characterization of 3D Through-Silicon-ViasFei Liu, Xiaoxiong Gu, et al.ECTC 2010
PaperMicrowave inductors and capacitors in standard multilevel interconnect silicon technologyJoachim N. Burghartz, Mehmet Soyuer, et al.IEEE T-MTT
Conference paperCopper-filled through wafer vias with very low inductanceKeith A. Jenkins, Chirag S. PatelIITC 2005