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Publication
INTERpack 1995
Conference paper
Tolerancing electronic packaging assemblies
Abstract
Electronic packaging assemblies are remarkably similar to mechanical assemblies. Design methodologies, standards, and inspection plans developed for the mechanical assemblies are also applicable to electronic packaging. In recent times, specification and control of part tolerances in mechanical assemblies have received much attention in the engineering community. This paper describes the current state of the art in standards and design methodologies that are applicable to electronic packaging assemblies.