Thermal conductance of Cu/Cu and Cu/Si interfaces from 85 K to 300 K

Abstract

The thermal conductance of copper-copper and copper-silicon interfaces has been measured between 85 K and 300 K. Bare surfaces and interface containing various thermal greases and thermally conductive elastomers have been evaluated. The use of thermal grease was found greatly to enhance thermal conductance of copper - copper interfaces at all temperatures. The use of thermal interface materials at the silicon - copper interface may or may not contribute to thermal conductance throughout the entire temperature range owing to a glass transition in the grease materials and the shear force created between silicon and copper by the different thermal contraction of the two materials as temperature is reduced. © 1992.