A. Nagarajan, S. Mukherjee, et al.
Journal of Applied Mechanics, Transactions ASME
The thermal conductance of copper-copper and copper-silicon interfaces has been measured between 85 K and 300 K. Bare surfaces and interface containing various thermal greases and thermally conductive elastomers have been evaluated. The use of thermal grease was found greatly to enhance thermal conductance of copper - copper interfaces at all temperatures. The use of thermal interface materials at the silicon - copper interface may or may not contribute to thermal conductance throughout the entire temperature range owing to a glass transition in the grease materials and the shear force created between silicon and copper by the different thermal contraction of the two materials as temperature is reduced. © 1992.
A. Nagarajan, S. Mukherjee, et al.
Journal of Applied Mechanics, Transactions ASME
A. Ney, R. Rajaram, et al.
Journal of Magnetism and Magnetic Materials
A.B. McLean, R.H. Williams
Journal of Physics C: Solid State Physics
Frank R. Libsch, Takatoshi Tsujimura
Active Matrix Liquid Crystal Displays Technology and Applications 1997