Mark W. Dowley
Solid State Communications
Peel tests were used to examine the adhesion between two layers of the polyimide pyro- mellitic dianhydride-oxydianiline (PMDA-ODA). The main thrust of this work was to examine these tests with particular emphasis on yielding in bending of the peeled strips. Two peel geometries and a range of sample thicknesses were used to study interfaces whose strength could be varied over a wide range by changing the cure schedule. The peel strength varied with strip thickness and often reached a peak at an intermediate thickness. The results were shown to agree qualitatively with a combination of two theoretical models for the effects of yielding on peel tests. It was also found that a second problem of polyimide adhesion, the effect of solvent swelling, could significantly enhance the adhesion between polyimide layers. © 1992, VSP. All rights reserved.
Mark W. Dowley
Solid State Communications
Gregory Czap, Kyungju Noh, et al.
APS Global Physics Summit 2025
T.N. Morgan
Semiconductor Science and Technology
Julian J. Hsieh
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films