About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
Qual Reliab Eng Int
Paper
Stress test development on a processor system
Abstract
Thermal cycling and vibration tests were carried out on an intermediate processor family of machines to investigate the benefits of controlled stressing as a means of screening manufacturing defects, and to provide data for return on investment calculations. Major items to be considered were (a) low cost of test programme (b) complete unit to be stressed (complex interactions between subassemblies) (c) relatively low expected failure rate (d) limited field reporting. Stress techniques used were mild thermal cycling and pseudo‐random vibration. Analysis of field data from the stressed population showed an overall reliability improvement of 24 per cent during the first 30 days of customer operation. Copyright © 1986 John Wiley & Sons, Ltd.