Christopher J. Morath, Humphrey J. Maris, et al.
Journal of Applied Physics
Thin carbon films were deposited by ion beam sputtering at temperatures of 77-1073 K. Using Rutherford backscattering spectrometry and electron energy loss spectroscopy, the trends in film density and bonding were examined as a function of deposition conditions. It has been found that film density and sp3 bonding character unexpectedly increased with increased substrate thermal conductivity and decreasing substrate temperature, reaching values of 2.9 g/cc and 50%, respectively.
Christopher J. Morath, Humphrey J. Maris, et al.
Journal of Applied Physics
Soon-Cheon Seo, L.F. Edge, et al.
VLSI Technology 2011
Jerome J. Cuomo, David L. Pappas, et al.
Journal of Applied Physics
Y.Y. Wang, John Bruley, et al.
Applied Physics Letters